Electronic module

ABSTRACT

Electronic module of printed circuit board with electronic components on one side and its other side in heat conducting contact with a heat sink enables the electronic components to be sealed from ambient atmosphere and thus unpackaged chips may be used. The modules are mountable in a support frame with air cooling passages of the heat sinks extending vertically for convected cooling air. In each module, a resistor network may extend into a cavity formed in a heat exchange rib and an electronic chip, perhaps unpackaged in the sealed environment, may be in heat conductive relationship with the heat sink.

This invention relates to electronic modules.

In the telecommunications industry, it is conventional practice toincorporate in telecommunications systems printed circuit boards whichare individually mounted as edge cards in a frame structure into whichthe edge cards are individually insertable and are connectable byconnectors at their rear edges into terminals in a backplane. Forinstance, edge cards may be used in switching or transmission systems,in the latter of which they may be used as receiver transmissionmodules.

There are various problems with the above conventional arrangement. Oneproblem concerns the removal of heat generated in use by electroniccomponents which extend outwardly from surfaces of the edge cards. Theheat generated, if not removed, is sufficient in many cases to causepremature failure of components thereby resulting in a high percentageof transmission or switching failures or malfunctions. Such a highfailure rate would be extremely costly in use of equipment and would behighly labor intensive for maintenance purposes.

To combat the above problem, edge cards are mounted in side-by-sidevertical planes and cooling air is driven upwardly between the cards byfans situated below groups of edge cards. While hot spots may develop insurface areas of cards which may detract from the life expectancy ofcertain electronic components, on the whole, cooling efforts have beensuccessful. However, the components are in contact with ambientatmosphere and are subject to humidity problems. In addition, dust andother foreign particles are driven upwardly by the fan and are depositedupon edge card and electronic components mounted thereon so to detractfrom the electronic performance. This deposition also provides thermallyinsulating layers which lessen the rate of heat removal thus causing anundesirable increase in temperature of the components. Because of thedeleterious effects of dust and other foreign particles, electronicchips are conventionally packaged so as to seal them. Packaging isexpensive and may provide an undesirable heat insulating function for achip which, unless adequately cooled, tends to increase in temperatureat a rapid rate with possible drastic results in performance.

The present invention seeks to provide a electronic module constructionwhich will alleviate or lessen the above problems.

According to one aspect of the invention there is provided an electronicmodule comprising a printed circuit board and a heat sink means, theprinted circuit board having one side surface with electronic componentsextending outwardly therefrom, the printed circuit board assembled withits other side surface in heat conducting relationship with a surface ofthe heat sink means, the heat sink means also having heat releaseprojection means exposed for contact by a flow of cooling fluid acrossthe heat release projection means, the module also including a covermeans covering the electronic components.

An electronic component in the electronic module of the invention mayfor instance comprise a packaged or unpackaged chip resistor orcapacitor or other individual electronic components manufactured forassembly onto a printed circuit board or for use as part of a ceramicresistor or hybrid.

The invention additionally includes an electronic module comprising aheat sink means having two side surfaces, a printed circuit board meanshaving two printed circuit board regions each of which is an electroniccomponent bearing region having one side surface with electroniccomponents extending outwardly therefrom, the bearing regions havingtheir other side surfaces in heat conductive relationship, one with eachof the two side surfaces of the heat sink means, the heat sink meansalso having a heat release projection means exposed for contact by flowof cooling fluid across the heat exchange projections, the module alsoincluding a cover means covering the electronic components.

In the above electronic modules according to the invention, the covermeans restricts the air flow across the electronic components and thusminimizes the presence of dust and other foreign particles upon thecomponents. In a preferred arrangement the cover means defines a chambermeans which houses the electronic components and the chamber means issealed from ambient atmosphere. This is easily achieved by the covermeans sealing directly either against the heat sink means or against theone side surface of the electronic component bearing regions of theprinted circuit board means. In the sealed arrangement, the chambermeans is completely separated from the ambient atmosphere and also fromthe air flow so that no dust or other foreign particles may enter thechamber means to contact the electronic components to deleteriouslyaffect electronic performance. In addition, because the electroniccomponent bearing regions of the printed circuit board are in heatconducting relationship with the heat sink means, then thermalmanagement may be achieved in which heat generated by the electricalcomponents is extracted through the printed circuit board and into theheat sink means to be removed by air flow on the other side of the heatsink means. The heat conducting relationship may be achieved by directand substantially intimate surface contact between the printed circuitboard means and the heat sink means or alternatively by the presence ofthermal grease or thermal polymer between the printed circuit boardmeans and the heat sink means.

It follows that with packaged or unpackaged chips and other electroniccomponents, the needs of the components are addressed, these needsincluding maintenance of cleanliness of components and efficient heatremoval.

It is envisaged that with the above electronic modules according to theinvention arranged so that the heat release projection mean defineupwardly extending passages between them, then an upward flow of coolingfluid, e.g. air, results and this flow may be created by naturalconvection as the air within the passages becomes heated. As a result,in certain designs, it may be possible to rely solely upon convection ofcooling fluid, preferably air, between the heat release projectionmeans, but it is also envisaged that in certain applications, fans maystill be used as required for driving the cooling air between the heatrelease projection means. However, as may be seen, with or without theuse of the fans, the cooling air passes between the projection means andit is impossible for the air to contact the electronic componentsdirectly.

In a preferred arrangement of an electronic module having two sidesurfaces, the heat sink means comprises two walls which are spaced apartto define passage means for the flow of cooling fluid, with the sidesurfaces facing in opposite directions on the outside of the walls. Inthis type of construction, the projection means preferably comprisesspaced apart ribs with the passage mean disposed between the ribs. Theseribs extend from each wall and are preferably rectilinear so as toextend upwardly in a certain position of use of the with the electronicmodules and with the ribs lying mutually in substantial parallelrelationship. The arrangement may be such that free ends of the ribs ofone wall oppose the free ends of corresponding ribs of the other walland these free ends may even contact each other. Alternatively, the heatsink means may be formed as an integral structure with the ribsextending completely from one wall to the other to define the passagemeans.

With the structure according to the invention it is also possible toprovide a rib as part of the projection means and in which the rib isprovided with a cavity which terminates in a position spaced from eachend of the rib. A corresponding electronic component bearing region ofthe board means has in this arrangement, a resistor which extends intothe cavity with sides of the cavity sufficiently close to the resistorthat heat exchange occurs across the gap from the resistor to the rib.

With the electronic module having two walls according to the invention,the two walls may be connected at one or each end with an end surfaceand the printed circuit board means may further comprise a connectormounting region carried upon the one end surface and electricallyconnected with each of the electronic component bearing regions.Alternatively, or in addition, the other end surface carries anadditional region of the printed circuit board, this additional regionalso being electrically connected with each of the electronic componentbearing regions. In this arrangement, the additional region may have asurface remote from the heat sink means and which supports electroniccomponents extending outwardly therefrom and the cover means extendsaround the heat sink means to cover the electronic components on thisadditional region.

The invention further includes a support frame and electronic modulecombination comprising a plurality of electronic modules each of whichcomprises a printed circuit board and a heat sink means, the printedcircuit board having one side surface with electronic componentsextending outwardly therefrom, the printed circuit board assembled withits other side surface in heat conducting relationship with a surface ofthe heat sink means, the heat sink means also having a heat releaseprojection means exposed for contact by a flow of cooling fluid acrossthe heat release projection means, each module including a cover meanscovering the electronic components; and a support frame comprising aplurality of adjacent receiving stations for reception and removal ofthe electronic modules with the heat release projection means of eachmodule, when within its station, defining upwardly extending passagemeans, the support frame also having means to permit a flow of coolinggas to pass into, upwardly through, and out from the passage means.

The invention further includes a support frame and electronic modulecombination comprising a plurality of electronic modules each of whichcomprises a heat sink means comprising two side surfaces, printedcircuit board means having two printed circuit board regions each ofwhich is an electronic component bearing region having one side surfacewith electronic components extending outwardly therefrom, the bearingregions having their other side surfaces in heat conductingrelationship, one with each of the two side surfaces of the heat sinkmeans, the heat sink means also having a heat release projection meansexposed for contact by a flow of cooling fluid across the heat exchangeprojections, the modules also including a cover means covering theelectronic component; and a support frame comprising a plurality ofadjacent receiving stations for reception and removal of the electronicmodules, with the heat release projection means of each module, , whenwithin its station, defining upwardly extending passage means, thesupport frame also having means to permit a flow of cooling gas to passinto, upwardly through, and out from the passage means.

With the latter support frame and electronic modules combinationaccording to the invention, the receiving stations may be disposedhorizontally side-by-side or in addition or alternatively the receivingstations are relatively vertically disposed. With the receiving stationspositioned vertically, the electronic components when in position in thereceiving stations should have their passage means interconnecting forupward flow of cooling gas. In addition, with the latter combinationaccording to the invention, it is possible for the heat sink means tohave an end surface extend between the two side surfaces and theconnecting mounting region of the printed circuit board is carried uponthe end surface and is electrically connected with each of theelectronic component bearing regions. In this arrangement, with eachelectronic module received into its receiving station by moving itrearwardly from a front towards the rear of the frame, the end surfaceof the heat sink means and the connecting mounting region face forwardlyfrom the front of the frame for frontal access to connectorize theprinted circuit board means. This arrangement of combination of frameand electronic modules provides an arrangement in which theconnectorization and access for removal and insertion of the modules maybe performed completely from the front of the frame. With such anarrangement therefore the use of a backplane as with normal edge cardtechnology is completely dispensed with.

In conventional edge card constructions, apart from the heat generatedby electrical components causing failure problems therewith, it isadditionally known that electronic chips tend to generate heat at afaster rate than other components and have their own specifictemperature problems which need to be overcome by cooling air. Thepresent invention also seeks to provide an electronic module which willalleviate or overcome this particular problem.

Accordingly, the present invention also includes an electronic modulecomprising a printed circuit board and a heat sink means, the printedcircuit board assembled to a surface of the heat sink means with oneside surface of the board facing outwardly from the heat sink means andthe other side surface in heat conducting relationship with the surfaceof the heat sink means, the module also comprising an electronic chipdisposed in heat conductive relationship with the heat sink means, thearrangement being such that heat passing from the chip to the heat sinkmeans bypasses the board.

With this arrangement according to this particular aspect of theinvention, rate of heat transfer from the chip to the heat sink meanscannot be lessened by any heat conducting peculiarities of the board. Incontrast, heat from the chip is taken directly into the heat sink meansand thus is emitted into any cooling fluid contacting the heat sinkmeans.

The invention also includes an electronic module comprising a printedcircuit board and a heat sink means, the printed circuit board assembledto a surface of the heat sink means which also has a heat releaseprojection means exposed for contact by a flow of cooling fluid acrossthe heat release projection means, the projection means including atleast one rib formed with a cavity which opens on the surface of theheat sink means and terminates in a position spaced from each end of therib, and the printed circuit board has a resistor network extendingoutwardly from the board and into the cavity with sides of the cavitysufficiently close to the resistor network that heat exchange occursacross the gap from the resistor network and into the rib.

With the above structure according to the invention, the resistornetwork is enclosed within the cavity which is closed at its ends, andcooling fluid is directed across the projection means so as not tocontact the network whereby heat is successfully extracted from it whilenot permitting it to become deleteriously coated with particles carriedby the cooling fluid.

In addition, the present invention includes an electronic modulecomprising a printed circuit board means comprising two printed circuitboards which are spaced-apart and which have circuitries electricallyconnected together by electrical conductors carried by aninterconnecting board region which is disposed between two electricallyconductive surface means connectable to ground and spaced from theelectrical conductors in the interconnecting board region to acapacitative effect and EMI filter for the printed circuit board meansand also to provide an EMI shield between the one printed circuit boardand the other.

Embodiments of the invention will now be described, by way of example,with reference to the accompanying drawings, in which:

FIG. 1 is an isometric view of an electronic module according to a firstembodiment;

FIG. 2 is an exploded isometric view from the same position as FIG. 1,but to a smaller scale, of the electronic module of FIG. 1;

FIG. 3 is an isometric view similar to FIG. 1 of part of the module ofthe first embodiment;

FIGS. 4 and 5 are end views of the module of the first embodiment taken,respectively, in the direction of arrows IV and IV in FIG. 3;

FIGS. 6 and 7 are respectively, horizontal and vertical cross-sectionalviews through the electronic module of the first embodiment taken alonglines VI--VI and VII--VII in FIG. 1;

FIG. 8 is a vertical cross-sectional view similar to FIG. 6 of a detailof part of the electronic module of the first embodiment and to a largerscale;

FIG. 9 is a front view of an assembly of electronic modules of the firstembodiment into a support frame;

FIG. 10 is a side elevational view of part of the assembly of FIG. 9 inthe direction of arrow X in FIG. 9 and to a larger scale;

FIG. 11 is a view similar to FIG. 6 of part of an electronic moduleaccording to a second embodiment and to a larger scale than in FIG. 6;

FIG. 12 is a cross-sectional view through an electronic module of athird embodiment;

FIG. 13 is a cross-sectional view through part of an electronic moduleof a fourth embodiment;

FIGS. 14 to 16 are cross-sectional views, respectively, throughelectronic modules according to fifth, sixth and seventh embodiments;and

FIG. 17 is an isometric view of an electronic module of the seventhembodiment and which is incorporated into the structure of the firstembodiment.

In a first, embodiment, as shown by FIG. 1, an electronic module 10, tobe used in conjunction with other modules in a support frame and modulecombination, comprises a heat sink means 12, a printed circuit boardmeans 14 (FIGS. 2 and 5 for example) and a cover means 16.

As is more clearly shown in FIGS. 2 and 6, the heat sink means comprisestwo parallel spaced-apart side walls 18 with two outwardly facing sidesurfaces 20 directed in opposite directions from the walls 18. Surfaces20 are interconnected at their two ends by two end surfaces providedupon end walls 22 and 24. As shown by FIG. 6, the end walls and the sidewalls lie at substantially 90° to each other so as to substantially forma parallelogram outer shape. The heat sink means 12 is formed of twoseparate heat sink structures 26 (FIG. 6), each of the structures 26comprising one of the walls 18 and half of each of the end walls 22 and24 so that in the assembly of the heat sink 26 the two parts of the endwalls substantially contact each other as shown in FIG. 6 in abuttingrelationship.

Each heat sink is also provided with integral heat release projectionmeans in the form of rectilinear and parallel ribs 28 which extendinwardly of the heat sink means from side walls 18 between end walls 22and 24. As may be seen from FIG. 6, the ribs 28 extend from the two heatsinks so as to form rib pairs from one heat sink to the other and freeends of the ribs 28 oppose each other and lie substantially in contact.This arrangement provides a passage means for the flow of a coolingfluid, namely air, between the ribs, the passage means being defined byseparate passages 30 defined by the substantially contacting pairs ofribs. In an alternative construction (not shown) the heat sink means isformed as an integral structure with the ribs extending from one wall 18completely across to the other. The printed circuit board means isconstructed as will now be described, to substantially surround the heatsink means by extending around the end walls and the side walls. Theprinted circuit board means is an integral structure (FIG. 2) comprisingtwo printed circuit board regions 32 with electronic components 34extending from one face of end region 32, the electronic components 34being of any desired type and being in any desired position to suit thecircuitry requirements of the printed circuit board. Two printed circuitboard regions 32 are integrally connected together by an additionalcircuit board region 36 which is small in facial area compared to theregions 32 so as to cover one of the wall 24. The printed circuit boardregion 36 is connected at each side with a specific region 32 by anarrow flexible connecting board region 38 which carries electricalconductors either upon one of its surfaces or embedded within the region38 for interconnecting circuitry of the two printed circuit boardregions 32. As may be seen particularly from FIGS. 4 and 6, the printedcircuit board region 36 also has electronic components 40 extending froman outer side surface of the assembly.

At their other ends, the board regions 32 are connected to a connectormounting region of the printed circuit board. The connector mountingregion comprises two separate narrow connector board strips 42 connectedby flexible interconnecting board regions 44 one to each of the boardregions 32. These interconnecting board regions carry electricalconductors for interconnecting terminals 46 of the printed circuit boardstrips 42 (FIGS. 3 and 5) with circuitry in the board regions 32. Asshown by the figures, (particularly FIG. 3), the printed circuit boardmeans 14 is wrapped around the side walls and end walls of the heat sinkmeans with the board regions 32 in heat conducting engagement with thesurfaces 20 and with the board region 36 and the connector board strips42 in heat conducting engagement with the end walls 22 and 24. The heatconducting engagement may be direct or a thermal grease or thermalpolymer may be sandwiched between the board regions and the surfaces ofthe heat sinks. As may be seen from FIGS. 3 and 6, in the assembly, allof the electronic components 34 and 40 face outwardly from the printedcircuit board means. To assemble the printed circuit board means ontothe heat sink structure, the flexible interconnecting board regions 38and 44 are flexed into arcuate form around convex end surfaces 46 of theheat sink 26, these convex surfaces 46 merging into the surfaces 20 andthe surfaces of the end walls 22 and 24. This is as shown in FIG. 6 andalso in greater detail in the enlarged partial view of FIG. 8.

The electronic module 10 is completed by the cover means 16. As shown byFIGS. 1, 2 and 6, the cover means comprises two half covers 50, each ofwhich extends across a board region 32 and partly around each end wall22 and 24 so as to cover substantially half of each of the additionalregion 36 and one of the printed circuit board strips 42. The two halfcovers 50 are brought together with edges 52 in substantial abuttingrelationship outwardly of the end walls 22 and 24. As shown by FIG. 6,each half cover 50 is formed with a wall 54, end walls 56 and 57 (FIG.6) and upper and lower walls 58 (FIG. 7), the walls 56, 57 and 58provided as flanges extending inwardly from one side of the wall 54. Endwalls 56 and 57 extend around the ends 22 and 24 to provide the abuttingedges 52 of the cover means. The half covers are sealed in positionaround the structure of printed circuit board and heat sink means withthe walls 58 extending in sealing engagement onto ends of the walls 18,22 and 24 of the heat sinks 26.

With the half covers 50 assembled in position as shown in FIG. 6, thewalls 54 are held spaced away from the regions 32 of the printed circuitboard to provide chambers 60 which are sealed from the ambientatmosphere and which house the outwardly extending electronic components34. In addition, each of the walls 56 extends at its outer end regionsas a thin wall region 62, the wall regions 62 acting together to definean additional chamber 64 which houses the outwardly extending electroniccomponents on the printed circuit board region 36 so as to seal themfrom ambient atmosphere. The cover also includes a connector coverportion 66 (FIGS. 1 and 6) mounted at one end of the structure upon thewalls 57 to shroud the terminals 43 on the printed circuit board strips44 and the connectors (not shown) when mounted thereon. One end of thecover portion 66 is also provided with a connector opening 67 formounting a power and data connector.

As mentioned above, each of the flexible interconnecting board regions38 and 44 of the board is flexed in the assembled condition into anarcuate shape which extends around a convex end surface 46 of the heatsinks 26. In addition, each of the walls 56 is thicker at the corners ofthe assembly as shown in FIGS. 6 and 8, so as to extend inwardly intoclose proximity with a corresponding interconnecting board region 38. Aninner surface 70 of each of the walls 56 is of concave configuration soas to lie substantially parallel to and oppose the whole of the convexouter facing surface of the corresponding interconnecting board region38. FIG. 8 shows clearly that a board region 38 extends around theconcave surface 46 of a heat sink 26 while lying extremely close to boththat surface and to the surface 70 of a wall 56. This closure is toprovide a capacitative and EMI filter effect between the electricalconductors in the interconnecting board region on one hand and thesurface 46 of the heat sink and the surface 70 on the other hand. Thedistances involved are in the order of a few mil, e.g. up to around 45mil, and are dependent upon the capacitative and EMI filter effectrequired. The structure also provides an EMI shield between the boardregions 32 and 36. For capacitance and EMI filter and shield purposes,the heat sink 26, which is formed from metal is connectable to groundpotential when mounted in a support frame structure to be described. Forthe same purpose, while each of the half covers 50 is suitably moldedfrom a dielectric plastics material, each of the surfaces 70 is providedby a coating of electrically conductive material 72 (FIG. 8) which isalso connectable to ground potential upon assembly into a support framestructure.

At the other end of the electronic module as shown in FIG. 6, requiredcapacitative EMI filter and EMI shield effects are similarly providedbetween each of the board strips 42 and the heat sinks 26 on the oneside and the walls 57 and the connector cover portion 66 on the otherside. The cover portion 66 is formed with a convex surface 74 at eachside in close association with the board strips 42 to extend the lengthof the conductive surface facing a strip 42. A conductive coating ispresent upon the concave surfaces 74 and of the walls 57 similar to thatpresent on the surface 70.

The electronic module 10 described above together with a plurality ofsimilarly constructed modules is suitable for assembly into a supportframe 80 such as is described with reference to FIGS. 9 and 10. Theframe 80 comprises two vertical main support members 82 between whichare disposed a plurality of vertically spaced horizontal supportplatforms 84 having a plurality of parallel rectilinear guiding supports86 projecting upwardly and downwardly therefrom. The supports 86 aredirected from the front 88 (FIG. 10) to a rear 90 of the framestructure. The guiding supports 86 are of T-shape as shown by FIG. 9with the lower row of supports 86 being of inverted T-shape and directlydisposed beneath the upper supports 86. Adjacent supports 86 are forsliding reception within grooves 89 provided towards the top and bottomedges of each of the half covers 50, for instance as shown in FIG. 1, toenable each of the modules 10 to be assembled into an individualreceiving station in the frame structure 80. As may be seen from theupper end of FIG. 9, five modules are disposed in this embodiment inhorizontal side-by-side relationship in respective receiving stations intwo vertically disposed rows of stations. In the upper stations, theguiding supports 86 are located in lower grooves 88 of the half covers50 while in the lower stations the electronic modules 10 hang downwardlyfrom the lower guiding supports 86 which are received in the uppergrooves 88 of the half covers 50. Each support plate 84 is formed withapertures (not shown) which coincide with the passages 30 for upwardflow of air upon assembly of the electronic modules into the frame.

With the electronic modules disposed in their receiving stations asshown at the top part of FIG. 9 and in FIG. 10, the passages 30 for flowof air extend upwardly between the ribs 28 and during use, the heatgenerated by the electronic components in each of the modules 10 istransferred through the printed circuit board and into the heat sinkmeans to be transferred from the ribs 28 into cooling air flowingupwardly through the passages. The design requirements are such that airis moved upwardly naturally by convection as it is warmed in thepassages 30 by the heat transfer so that cooling fans are not required.Of course with two or more of the electronic modules arranged invertical alignment in their respective receiving stations as shown inFIGS. 9 and 10, then the convection effect is increased so as to providebetter upward flow of air. The air is drawn into the frame structurethrough entrances 92 provided by box structures 94 having a lowersloping panel 96 and an upper horizontal panel 98 the air movingupwardly through apertures in the upper horizontal panel 98 disposedbeneath the lower horizontal row of electronic modules. The air exitsfrom an exit passageway 100 having an upper boundary provided by anupper sloping panel 102 (FIG. 10) and passes through an interconnectingaperture 104 in a wall 106 upon which the frame structure 80 is mounted.The distance between the entrance 92 and exit passageway 100 for the airis partly dependent upon the amount of heat transfer which is requiredand may be positioned, for instance, to accommodate air flow throughone, two or more horizontal rows of receiving stations. In FIG. 10,there are two horizontal rows of receiving stations each containing fivemodules 10 between the entrance 92 and exit passageway 100.

The electronic modules 10 having flat sides provided by the walls 54 ofthe cover means to provide a compact storage arrangement in the supportframe structure with the walls 54 lying side-by-side and in closeproximity with each other. As may be seen, because of the use of thecover means, particularly in a sealing capacity as described in theembodiment, it is impossible for ambient air to contact the electroniccomponents carried by the printed circuit board means and thus theperformance of these components does not deteriorate due to accumulationof dust or foreign particles upon them. In this embodiment, each module10 has approximate overall dimensions of 3.4 inches wide, a height of7.4 inches and a depth between the walls 56 and cover portion 66 of 8.8inches, and is thus easily managed manually for insertion and removalpurposes and for general handling.

While the electronic components of the first embodiment and according tothe invention should preferably be used with convected air, cooling fansmay of course by employed is deemed necessary. The cover means of eachof the modules will, of course, still protect the electronic componentsof the printed circuit board from the effects of dust or other foreignparticles with use.

As described in the above embodiment, the printed circuit board means isconstructed with the printed circuit board regions 32 spaced apart bythe additional board region 36 and its additional board region 38 andthe connector board strips 42 being disposed at the remote edges of theregions 32, the arrangement being such that the printed circuit boardmeans may be wrapped around the heat sink means. In an alternativeconstruction (not shown), the connector mounting region is a singleregion instead of two strips as the strips 42 in the first embodiment,and is disposed between the board regions 32 in the position describedfor the board region 38 in the embodiment. In this alternative case, theadditional board region is provided as two separate strips disposedalong the remote edges of the region 32 in a similar manner to thestrips 42 in the first embodiment.

In a further alternative, the printed circuit 1 board means includes twoboards each of which comprises a printed circuit board region 32 and astrip at each end, one strip being similar to a printed circuit boardstrip 42 and the other strips being part of the region 36 of the board.

A second embodiment of the invention is shown in FIG. 11 which is a partsectional view similar to that of FIG. 6 in the first embodiment and toa larger scale. The second embodiment is basically of the same structureas the first embodiment and the same reference numerals are used forsimilar parts.

In the second embodiment, a heat sink means 110 has two separate heatsinks 112 constructed substantially as described for the heat sinks 26of the first embodiment. However, in this embodiment, certain of theribs 111 of the heat sinks 112 are formed with longitudinally extendingcavities 113 as shown by FIG. 11, these cavities terminating a distancespaced from the ends of the ribs so that a flow of air cannot pass alongthem. A circuit board means 114 comprises two individual printed circuitboards 115 each of which comprises a printed circuit board region 32having surface mounted electronic components 34 and a board strip 42 ofthe connector region disposed at one end of the region 32 and connectedto region 32 by a flexible interconnecting strip 44. At the other end ofeach board region 32 is disposed another board region 116 which extendsaround the end wall 117 of the heat sink and terminates on the sameplane as the free ends of the ribs 111. Edges of the board regions 116of the two boards lie in close relationship as shown. Each of the boardregions 32 has, in addition to the electronic components 34, planarresistor networks 118 which extend from the opposite face of each boardregion, the planar resistor networks entering into and being housedwithin the cavities 113 in the ribs 111. Sides of each cavity aresufficiently close to the respective resistor network 118 that heatexchange will occur across the gap from the resistor network and intothe corresponding rib 111. Hence, the arrangement of the resistornetworks within the cavities 113 provide for heat exchange from the ribs111 into air passages 30. The resistor networks of course can not becontacted by dust or other foreign particles because they lie within thecavities which are otherwise closed except for the opening foracceptance of the resistor networks.

In a third embodiment as shown by the section in FIG. 12, an electronicmodule 120 comprises a heat sink means in the form of a single heat sink122 which is of similar construction to a heat sink 112 of the secondembodiment and is also provided with cavities 124 in ribs 126 similar tothe cavities 113 in the ribs 111 of the second embodiment. In this thirdembodiment, a printed circuit board means comprises a single planarboard 128 having electronic components 130 extending from one surface ofthe board. The board is mounted upon a planar surface of a wall 132 ofthe heat sink 122 with the electronic components facing outwardly andinto a chamber 134 which is sealingly enclosed from ambient atmosphereby a cover 136, the cover having laterally extending walls 138 which aresealed at their edges to the heat sink 122. As shown by FIG. 12 the heatsink is mounted upon a wall 140 of a frame structure so as to definewith the wall 140 air flow passages 142 through which cooling air may bepassed, preferably by convection, or by fan assisted means forextracting heat from the electronic components 30 through the ribs 126.

The advantages of the third embodiment and the method of operation areas described for the first embodiment.

In a fourth embodiment, a capacitance effect is provided for a printedcircuit board means for a different configuration of the features fromthat described in the first embodiment. In the fourth embodiment asshown by FIG. 13, a printed circuit board means comprises two printedcircuit boards 150 which are substantially coplanar and areinterconnected by an interconnecting board region 152 of much thinnersection than the boards 150. The interconnecting board region 152 whichmay be, if required, a flexible board region, but is disposed in thisembodiment in a substantially planar condition so that conductors in theboard region 152 each extends along a single plane between the twoprinted circuit boards 150. The electrical conductors (not shown) may bedisposed entirely within the interconnecting board section 152 or may bedisposed at least partly upon a surface of the board region. To providedesirable capacitative and EMI filter effects for the printed circuitboard means, two electrically conductive surface means are provided insuitably spaced positions one on each side of the printed circuit boardregion 152. These electrically conductive surface means are provided bytwo grounded conductive members 154 as shown in FIG. 13, the distancesbetween the electrical conductors in the printed circuit board region152 and opposing surfaces 156 of the members 154 being controlled to asuitable gap of for instance from 9 to 45 mil to provide the requiredcapacitative filtering effects. In Addition, the grounded conductivemembers 154 on each side of and located close to the board region 152,provide EMI shielding from one board 150 to the other.

In further embodiments now to be described, an unpackaged electronicchip is mounted in heat conductive relationship with the heat sink meanssuch that heat passing from the chip to the heat sink means bypasses aprinted circuit board means which is also incorporated in the structure.This is exemplified in a fifth embodiment and as shown by FIG. 14 inwhich a heat sink 160 has a wall 162 provided with a planar supportsurface 168 and heat exchange projection means in the form of ribs 164extending from an opposite side of the heat sink with air flow passages166 passing between the ribs. On the planar support surface 168 of theheat sink is disposed a planar printed circuit board 170. The printedcircuit board 170 carries an unpackaged electronic chip 172 which issupported upon a planar heat conductive carrier 174. A plurality ofplated through holes 176 are provided through the printed circuit boardand heat conductive pegs 178 secured to the plate 174 extend through theholes and are soldered to the plating to secure the plate 174 and chip172 in position. Free ends of the pegs terminate at the opposite sidesurface of the printed circuit board. The printed circuit board isassembled onto the planar surface 168 of the heat sink 160 with the freeends of the pegs 178 in heat conductive relationship with the surface168. This heat conductive relationship may be achieved by the use ofthermal grease disposed between the ends of the pegs and the surface168.

In use of the structure of the fifth embodiment, heat generated by thechip 172 is conducted away by the plate 174 and by the pegs 178 into theheat sink 162 and is extracted from the heat sink ribs 164 by coolingair flowing along the passageways 166. Sufficient heat will be removedfrom the chip 172 to prevent its failure even though the circuit boardand the chip may be covered by a cover means such as is described in thefirst embodiment. With this construction it is preferably that thethermal coefficients of expansion of the chip 172, the support plate 174and the heat sink 162 are suitably matched to prevent damage to any ofthe parts or to produce any separation between them which could have adeleterious effect upon heat conduction. For instance, if the chip 172has an expansion rate of 3 parts/million and the heat sink 162 anexpansion rate of 24 parts/million then the plate 174 should have a rateof expansion between those two rates and should be compatible with them.For instance, the plate 174 may have a thermal expansion rate of from 10or 12 parts/million.

In the sixth and seventh embodiments now to be described and in whichlike parts bear the same reference numerals as in the fifth embodiment,the thermal coefficients of expansion should be matched in a mannersimilar to that described with regard to the fifth embodiment.

In the sixth embodiment as shown by FIG. 15, the unpackaged electronicchip 172 is bonded to an insert plug 180 which is force fitted into alarge diameter hole in the printed circuit board 170. The plug 180 is inheat conductive engagement with the surface 168 of the heat sink 160 bythe disposition of a thermal grease between the plug and the surface.

In use of the construction of the sixth embodiment, heat emitted fromthe chip 172 is passed through the plug 180 and into the heat sink 160so as to bypass the printed circuit board 170.

In a seventh embodiment as shown in FIG. 16, the electronic chip 172 isnot supported by the printed circuit board. In this construction, theprinted circuit board 170 is formed with a window or square-shapedaperture 182 into which the chip 172 is positioned upon a planarconductive support 184, the support mounted directly upon the heat sinkby a heat conductive board. The chip and the support 184 are spaced fromthe sides of the window 182 as shown in FIG. 17.

One or more electronic chips arranged so as to bypass heat around aprinted circuit board and as described in the fifth, sixth and seventhembodiments may be incorporated in any of the electronic modulesdescribed in previous embodiments. For instance, as shown in FIG. 17,the structure of the seventh embodiment is incorporated into a printedcircuit board means and heater exchanger arrangement generally of thestructure described in the first embodiment. As shown in FIG. 17, one orboth of the regions 32 of the printed circuit board means 14 is providedwith an aperture or window 182 and into which the chip is mounted uponits support 184. The chips are interspersed as necessary across theregions 32 together with the electronic components 34 so as to becovered by the half covers 50 of the cover means.

What is claimed is:
 1. An electronic module comprising:heat sink meanshaving two spaced and opposed sidewalls and two end walls at oppositeedges of the sidewalls to define passage means bordered by the sidewallsand by the end walls, the passage means having opposite ends which areopen for slow of a cooling fluid through the passage means, eachsidewall having an outer surface facing away from the passage means, theheat sink means also having heat release projection means extending intothe passage means from the sidewalls; two printed circuit boards whichare mounted one upon each of the outer surfaces of the sidewalls to forman assembly of heat sink means and printed circuit boards with eachprinted circuit board having a major surface remote from the heat sinkmeans and electronic components mounted upon said remote major surface;and a cover means which is mounted upon the assembly of heat sink meansand printed circuit boards and which covers the electronic components oneach of the printed circuit boards.
 2. An electronic module according toclaim 1 wherein an additional circuit board is mounted upon the outersurface of an end wall and at least one of the printed circuit boards isinterconnected with the additional circuit board through a flexiblecircuit board means.
 3. An electronic module according to claim 1wherein the projection means comprises spaced-apart ribs extending intothe passage means.
 4. An electronic module according to claim 2 whereinthe ribs extend from each sidewall and are rectilinear with the ribslying mutually in substantially parallel relationship.
 5. An electronicmodule according to claim 3 wherein each rib of each sidewall has a freeend opposing a free end of a corresponding rib of the other sidewall. 6.An electronic module according to claim 4 wherein the free ends ofcorresponding ribs contact each other.
 7. An electronic module accordingto claim 2 wherein the ribs extend across the passage means fromsidewall to sidewall to form the heat sink means into an integralstructure.